By Gordon Roberts, Friedrich Taenzler, Mark Burns
Built-in circuits incorporating either electronic and analog features became more and more universal within the semiconductor undefined. Mixed-signal IC attempt and size has grown right into a hugely really expert box of electric engineering. besides the fact that, attempt engineering remains to be a comparatively unknown career in comparison to IC layout engineering. It has turn into tougher to rent and educate new engineers to turn into expert mixed-signal try engineers. The sluggish studying curve for mixed-signal try engineers is essentially as a result of scarcity of written fabrics and university-level classes almost about mixed-signal trying out. whereas many textbooks were dedicated to the topic of electronic try and testability, a similar can't be acknowledged for analog and mixed-signal automatic attempt and measurement.An advent to Mixed-Signal IC try and dimension is a textbook for complex undergraduate and graduate-level scholars in addition to engineering pros. It was once written according to the lack of simple path fabric for mixed-signal attempt and size. The ebook assumes a pretty good heritage in analog and electronic circuits in addition to a operating wisdom of pcs and laptop programming. A history in electronic sign processing and statistical research is usually invaluable, although now not completely necessary.This textual content encompasses the checking out of either analog and mixed-signal circuits together with many borderline examples. electronic checking out is roofed, yet no longer as commonly as a result of the wealth of data in this subject already on hand. Examples and illustrations utilizing cutting-edge commercial know-how improve and brighten up the presentation all through. In contemplating the purposes of this expertise, the trying out of large-scale mixed-signal circuits and person circuits is brought. The value-added merits of mixed-signal IC trying out to a manufacturer's product are in actual fact mentioned, and the function of the try out engineer is obviously outlined.
Read or Download An Introduction to Mixed-Signal IC Test and Measurement PDF
Best circuits books
This bestseller offers thorough, up to date assurance of electronic basics, from easy suggestions to microprocessors, programmable common sense, and electronic sign processing. Its brilliant full-color structure is choked with pictures, illustrations, tables, charts, and graphs; invaluable visible aids that latest person must comprehend this frequently advanced desktop program.
Software program outlined Radio makes instant communications more uncomplicated, extra effective, and extra trustworthy. This ebook bridges the space among educational learn and sensible implementation. while starting a undertaking, practising engineers, technical managers, and graduate scholars can store numerous hours by means of contemplating the options offered in those pages.
- Discrete-Time Processing of Speech Signals (IEEE Press Classic Reissue)
- Thin-Film Transistors
- Broadband Direct RF Digitization Receivers
- Liquid Crystal Displays. Addressing Schemes and Electro-Optical Effects
- Metal-semiconductor contacts and devices
Extra resources for An Introduction to Mixed-Signal IC Test and Measurement
32 An Introduction to Mixed-Signal IC Test and Measurement TLC7524C,TLC7524E,TLC75241 S-BIT MULTIPLYING DIGITAL-TO-ANALOG CONVERTERS SLASOG1B - SEPTEMBER 1986 - REVISED NOVEMBER~ APPLICATION INFORMATION voltage-mode operation It is possible to operate the current-multiplying DAC in these devices in a voltage mode. In the voltage mode, a fixed voltage is placed on the current output terminal. The analog output voltage is then available at the reference voltage terminal. Figure 1 is an example of a current-multiplying DAC, which is operated in voltage mode.
Whena PGA is combinedwith a digital logic block to keepa signalat a constantlevel, whatis the combinedcircuit called? 8. Assumea particle of dust lands on a photomaskduring the photolithographicprinting processof a metal layer. List at leastonepossibledefectthat might occurin the printed IC. 9. Why does the cleanliness of the air in a semiconductor fabrication area affect the number of defects in IC manufacturing? 10. List at least four production stepsafter wafers have been fabricated. Chapter 1 .
Cext= 13 pF, WRatOV, CSatOV, OBO- DB7 atOVto VDO orVDDtoOv. ,-, ~ TEXAS INSTRUMENTS POST OFFICE BOX 655303 . DAllAS. 4. Electricalspecificationsand timingdiagram. 4, Note I statesthat the "Gain error is measured using the internal feedback resistor.. " This piece of information is vital, since the gain error specification is ambiguous without it. Data sheet ambiguities can lead to frustrating correlation efforts. For instance, if Note I was missing, the test engineer might use the internal resistor to measure gain error while the customer uses an external resistor.
An Introduction to Mixed-Signal IC Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns